Vol. 3 No. 2 (2025): Electronics Communications, and Computing Summit -Summer 2025 (Apr -Jun)

View Vol. 3 No. 2 (2025): Electronics Communications, and Computing Summit -Summer 2025 (Apr -Jun)

The Summer 2025 issue (Vol. 3 No. 2) of Electronics, Communications, and Computing captures the essence of innovation and interdisciplinary collaboration presented during the Electronics, Communications, and Computing Summit  held in the second quarter of the year.

Spanning the months of April to June, this issue showcases high-quality research contributions in areas such as advanced semiconductor technologies, AI-driven communication protocols, cyber-physical system integration, and next-generation processor design. Also featured are impactful works on IoT scalability, millimeter-wave communication, and energy-aware computing infrastructures.

This volume reflects the summit’s commitment to bridging academic excellence with real-world applications, offering readers valuable insights into emerging trends at the convergence of electronics, computing, and communications.

Published: 2025-06-24

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