Archives

  • Electronics Communications, and Computing Summit -Summer 2025 (Apr -Jun)
    Vol. 3 No. 2 (2025)

    The Summer 2025 issue (Vol. 3 No. 2) of Electronics, Communications, and Computing captures the essence of innovation and interdisciplinary collaboration presented during the Electronics, Communications, and Computing Summit  held in the second quarter of the year.

    Spanning the months of April to June, this issue showcases high-quality research contributions in areas such as advanced semiconductor technologies, AI-driven communication protocols, cyber-physical system integration, and next-generation processor design. Also featured are impactful works on IoT scalability, millimeter-wave communication, and energy-aware computing infrastructures.

    This volume reflects the summit’s commitment to bridging academic excellence with real-world applications, offering readers valuable insights into emerging trends at the convergence of electronics, computing, and communications.

  • Electronics Communications, and Computing Summit -Spring 2025 (Jan -Mar)
    Vol. 3 No. 1 (2025)

    The Spring 2025 issue (Vol. 3 No. 1) of Electronics, Communications, and Computing launches the third volume with a compelling collection of scholarly articles and summit proceedings from the Electronics, Communications, and Computing Summit   held during the first quarter of the year.

    Covering the months of January to March, this issue features original research and expert insights on adaptive computing systems, high-frequency communication architectures, low-power embedded design, and intelligent signal processing frameworks. Emerging trends such as quantum-inspired electronics, 6G-enabling technologies, and AI-integrated VLSI are explored in depth, demonstrating the summit’s commitment to future-focused innovation.

    This edition exemplifies the ECC Summit's role in advancing transformative technologies that integrate hardware, communication protocols, and computational intelligence—contributing to the global evolution of smart and secure electronic ecosystems.

  • Electronics, Communications, and Computing Summit -Winter 2024 (Oct-Dec)
    Vol. 2 No. 4 (2024)

    The Winter 2024 issue (Vol. 2 No. 4) of Electronics, Communications, and Computing marks the conclusion of Volume 2 with a rich compilation of high-impact research and summit contributions from the final quarter of the year. This special issue captures the highlights of the Electronics, Communications, and Computing Summit, focusing on seasonal advancements, keynote perspectives, and emerging academic-industry collaborations.

    Articles in this edition explore cutting-edge developments in reconfigurable hardware, terahertz communication systems, intelligent sensor networks, and AI-accelerated edge computing. It also features in-depth analyses of secure communication protocols, neuromorphic circuits, and sustainable computing models optimized for real-time deployment.

    With a strong emphasis on interdisciplinary integration and innovation, this issue reflects the ECC Summit’s role as a catalyst for shaping the next wave of research in electronics, wireless communications, and intelligent computing technologies.

  • Electronics Communications, and Computing Summit - Autumn 2024 (Jul-Sep)
    Vol. 2 No. 3 (2024)

    The Autumn 2024 issue (Vol. 2 No. 3) of Electronics, Communications, and Computing continues the tradition of spotlighting breakthrough innovations presented during the Electronics, Communications, and Computing Summit . This edition brings together a curated selection of original research papers, technical briefs, and summit insights spanning the critical months of July to September 2024.

    Featured topics include advancements in smart antenna design, cyber-physical systems, low-power VLSI, 5G/6G protocol enhancements, and cloud-edge integration for AI-driven applications. Special attention is given to real-time computing platforms, secure embedded systems, and machine learning for communication optimization.

    This issue underscores the ECC Summit’s commitment to fostering interdisciplinary collaboration and knowledge dissemination across academic, industrial, and policy-making communities, focusing on the future of scalable, efficient, and secure electronic and computing infrastructures.

  • Electronics Communications, and Computing Summit -Summer 2024 (Apr-Jun)
    Vol. 2 No. 2 (2024)

    The Summer 2024 issue (Vol. 2 No. 2) of Electronics, Communications, and Computing is a Special Conference Edition dedicated to the Electronics, Communications, and Computing Summit. This volume showcases peer-reviewed papers, keynote highlights, and technical contributions presented at the summit, reflecting the latest advancements in digital electronics, next-generation communication protocols, and intelligent computing systems.

    Spanning topics from high-speed VLSI architectures and embedded AI to quantum communication links, software-defined networking, and secure IoT frameworks, this edition captures the multidisciplinary spirit of the summit. Notable contributions include innovative hardware-software co-design strategies, signal intelligence algorithms, and resilient system architectures for mission-critical applications.

    This special issue serves as a platform to disseminate high-impact research discussed during the summit, bridging academic insights with real-world industrial and societal applications.

  • Electronics Communications, and Computing Summit -Spring 2024 (Jan- Mar)
    Vol. 2 No. 1 (2024)

    The Spring 2024 issue (Vol. 2 No. 1) of Electronics, Communications, and Computing Summit presents cutting-edge research and emerging technologies that lie at the intersection of intelligent electronics, advanced communication systems, and modern computing architectures. This volume highlights multidisciplinary innovations in embedded systems, next-generation wireless networks, AI-integrated edge computing, and signal processing techniques for real-time applications.

    Contributors from academia and industry offer in-depth studies on topics such as software-defined radios, reconfigurable computing, energy-efficient IoT platforms, and secure data transmission protocols. The issue also includes special focus articles on 6G communication paradigms, VLSI design trends, and machine learning models for adaptive system behavior.

    Together, these contributions aim to foster academic exchange and accelerate progress in the design and deployment of scalable, intelligent, and energy-aware electronic and communication infrastructures.

  • Electronics, Communications, and Computing Summit -Winter 2023 (Oct-Dec)
    Vol. 1 No. 1 (2023)

    Electronics, Communications, and Computing (ECC) Summit – Winter 2023 

    Theme: Advancing Innovation at the Intersection of Technology and Intelligence

    The ECC Summit – Winter 2023 is a premier interdisciplinary platform bringing together leading researchers, industry experts, academicians, and innovators to exchange ideas, showcase advancements, and explore emerging trends in the fields of Electronics, Communications, and Computing.

    Held during the winter season of 2023, the summit serves as a catalyst for collaborative research, transformative technologies, and industry-academia partnerships. The event features technical paper presentations, keynote speeches, panel discussions, workshops, and product demonstrations that address critical challenges and next-generation solutions across diverse ECC domains.

    Focus Areas:

    • VLSI, Embedded Systems, and Nanoelectronics

    • Wireless Communication, 5G/6G, and Antenna Systems

    • AI and ML in Edge Computing and Signal Processing

    • IoT, Cyber-Physical Systems, and Smart Infrastructure

    • Quantum Computing, Blockchain, and Cybersecurity

    • High-Performance and Green Computing Architectures